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Manufacturing and Assembly

FreeBCI Spike is published as an open hardware release package for review, fabrication reference, and prototyping. It is not a full editable hardware source release.

What Is Published

Each module release currently provides:

  • schematic PDF
  • Interactive BOM HTML
  • Gerber ZIP

These are the main inputs for review, fabrication planning, and assembly reference.

What Is Not Published

At this stage, public release files do not include:

  • editable EDA source projects
  • firmware source code
  • enclosure or mechanical files
  • production test procedures
  • fab qualification reports
  • regulatory documentation

That means manufacturing and assembly remain an engineering activity that requires your own review and validation.

  1. Module README / overview page
  2. Schematic PDF
  3. Interactive BOM
  4. Gerber ZIP

Use the Gerber package only after the earlier review steps are complete.

Before Ordering Boards

Confirm:

  • the target module and release date
  • the contents of the Gerber package
  • connector and power context in the schematic
  • whether your board house needs extra drill, stackup, or note files

Assembly Guidance

Use the Interactive BOM together with the schematic PDF.

Pay special attention to:

  • polarity-sensitive parts
  • fine-pitch analog front-end soldering
  • connector orientation
  • battery-related circuits
  • visible solder bridges and opens

Traceability

If you fabricate derived boards, keep your own:

  • build records
  • lot tracking
  • revision notes
  • bring-up notes

Public release files are not a substitute for internal manufacturing control.

Next

Spike 1CH LH001
Spike 8CH ADS1299